utc_news

2002 – November
	UltraTera announces samples availability for its line of innovative teBGA Type I & teBGA Type II thermally enhanced families of IC packages
	UltraTera presents at 11/12/2002 Meptec laminate substrate symposium in Sunnyvale, Ca
	UltraTera announces availability of wire-bonded, 1.4mm maximum thickness 4-die-stacked packages for mobile applications
2002 – October
	UltraTera presents at Jedex Beijing
	UltraTera introduces its revolutionary 3D printing technology for stacked “any-die” IC packages. A liquid “spacer” leapfrog current silicon/film spacer technologies at significant cost and flexibility advantages
	UltraTera announces availability of DRAM-Stack packages for high density applications up to 1Gb DDR333
	UltraTera announces availability of thinnest 2-any-die stackBGA package at 1.0mm max
2002 – July
	UltraTera announces the approval of R-Mask™ patent for elimination of solder masks in laminate substrates
2002 – May
	UltraTera presents revolutionary R-Mask™ substrate technology at Meptec luncheons
2002 – March
	UltraTera participates in Jedex San Jose, Ca event – Presents high performance wBGA™ DRAM IC assembly solution