testing_service

Testing is carried osut on wafer level and packaged semiconductor devices to ensure that they meet the electrical performance specifications. This involves the use of advanced testing equipment and customized software to test a number of attributes of integrated circuits, including connectivity, functionality, speed, predicted endurance and power consumption.

At UTC, we provide effective test solutions that addres the full range of industry requirements. These include wafer probing and final package testing of memory, logic and mixed signal semiconductors. We maintain different types of most advanced testing equipment, sophisticated technology and expertise in the industry to test numerous semiconductor functions with respect to the product's performance specification. Through our highly dedicated and experienced test engineering team, we develop innovative test methodology that helps our customer in keeping pace with the latest test technologies. The team will work closely with customer from productization to mass production in order to develop the most efficient and cost effective test solutions to within the shortest time to market. Once in mass production, our experience and dedicated engineering team will continue to provide our customers with all necessary support in maintaining production on a daily basis.

In enhancing our testing service, we also provide additional services to our customers in strengthening their product reliability and visual mechanical quality. UTC has an extensive number of equipment in supporting burn in and End-of-Line service such as laser marking, lead/ball scanning, lead/ball rectifying, baking and tape & reel.