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| teBGA
{thermal enhanced} |
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| Package
Key Features |
- Liquid encapsulation protection
- No D/A Material
- Unique and optimized Cu paste process/material
- Low profile W/B technology can reduce total
PKG profile per customer¡¦ requirements
- Fully grounded Chip can guarantee maximum electrical
performance
- Die face-up design for thermally enhanced
PKG solution !
- Direct thermal dissipation path to system
board is possible
- UTC patented PKG structure/process
- Higher reliability with Rmask™
substrates
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