assmebly service

IC packaging is the essential technology that interconnects electrical signals between a integrated chip onto the external system board and provides protection against environmental stresses to the delicate chip. Unlike traditional IC packaging, the ever increasing demand for low profile, small foot-print, light weight, high power dissipation, and better performance semiconductor devices has called for the increasing need in more advanced and customized semiconductor packaging.

UltraTera Corporation (UTC) has successfully developed and employed unique materials and advanced assembly processes that resulted in a semiconductor assembly manufacturing flow that is significantly simpler, lower temperature, lower cost and faster cycle time than standard assembly processes. Unlike conventional assembly service providers that focuses in lead frame based packages, UTC's assembly services only focus in laminate material packages. Pivoting around UTC's proprietary Rmask™ substrate that replaces the traditional solder mask coating with the original intrinsic resin coating, UTC's packaging uses a substrate that is higher in Tg and lower in CTE as compared to other packaging suppliers. This enables UTC to provide a highly reliable package that easily meet MSL Level II at 260C requirement for all applications.

UTC's packaging technology also employ our patented printing technology that provide an almost mechanically stress free environment to the package. In conjunction with UTC's patented silicon-based liquid elastomer die attached material and liquid encapsulation, the deployment of our patented "Shield and Place" and "Safe Shield" printing technology extends the life-span of wire bonding technology and enhances the packages reliability and stability when subjected to high environmental and application stress. In 3D stacked and/or System in Package (SiP) applications, we also employ the silicon-based liquid die attached material and printing technology to replace the conventional, expensive and thick wafer spacer and/or film spacer and turns super low profile, fine pitch and/or same die size stacked packages into reality.

UTC also provide Thermally Enhanced Packages (TeBGA) for high power dissipation products. Unlike conventional power packages that pre-attached the heat dissipation metal to the substrate before the package assembly process, UTC's utilizes normal substrate for our Thermal Enhanced Packages. By using our patented printing process, the heat dissipation metal is attached to the package at the end of our assembly process. Where substrate cost is general the most expensive material in IC packaging, this provides an up front substrate cost parity between normal substrate used in UTC's assembly process as compared to the pre-attached substrate.

In summary, UTC's unique material and assembly technology enable us to serve our customers with the most competitive assembly solution by satisfying the rising demand in low profile, fine pitch, small footprint and high power dissipation package applications. Moreover, the short turn around time in printing stencils delivery enable us to support our customers in accomplishing early time to market for their new product development. With our high manufacturing yield, outstanding reliability and an intrinsic versatile manufacturing line, we look forward partnering with you in our assembly and test solution to make your product a success in the highly competitive semiconductor market.

At the moment, we are offering the following packages in our assembly services :